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Listed ten hours ago

Thermal Engineer (IANG Holder Is Welcome)

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Technical Writing
Technical Writing
classification: Information & Communication Technology
(Information & Communication Technology)
  • Degree or higher in Mechanical Engineering / Physics or relevant disciplines
  • Design cooling and heating systems and follow through the deployment
  • Drive thermal designs with numerical approaches, model based analysis
10h ago
Be an early applicant
Listed seventeen days ago

Thermal Engineer (IANG Holder Is Welcome)

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Technical Writing
Technical Writing
classification: Information & Communication Technology
(Information & Communication Technology)
  • Degree or higher in Mechanical Engineering / Physics or relevant disciplines
  • Design cooling and heating systems and follow through the deployment
  • Drive thermal designs with numerical approaches, model based analysis
17d ago
Be an early applicant
Listed eighteen days ago

Technical Writer / Solution Architect - Bid Management

at HKBN Enterprise Solutions HK Limited (HKBNES)

This is a Full time job

Kowloon Bay, Kwun Tong District
$35,000 – $40,000 per month
subClassification: Technical Writing
Technical Writing
classification: Information & Communication Technology
(Information & Communication Technology)
  • Focus on technical proposal writing
  • Technical Proposal and Tender Specification Writing
  • 3-5 years of relevant experience in ICT industry
18d ago
Be an early applicant
Listed twenty seven days ago

Thermal Engineer (IANG Holder Is Welcome)

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Technical Writing
Technical Writing
classification: Information & Communication Technology
(Information & Communication Technology)
  • Degree or higher in Mechanical Engineering / Physics or relevant disciplines
  • Design cooling and heating systems and follow through the deployment
  • Drive thermal designs with numerical approaches, model based analysis
27d ago
Be an early applicant
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