Job description and responsibilities:
lDesigning and modeling of micro-optic devices such as wafer-level optics (WLO), diffractive optics element (DOE), Fresnel lens, etc.
lDeveloping of microprocess for fabricating WLO and DOE from lab tests to industry requirements, make critical analysis for process yield, and conduct Design of Experiment for process improvement.
lEngaging in micro-optic processes in foundry Fab line for E-beam lithography, DRIE, PECVD, evaporation/nanoimprinting etc.
lEngaging in DOE and WLO housing aligned with VCSEL light source, etc.
lWLO and DOE testing (transparency, imaging deformation, diffractive angle analysis, and reliability).
lOccasionally travel to Mainland China when required.
lBSc/BEng/MPhil/PhD degree in Optics Engineering/Physics or other related disciplines have experiences in any one of the following areas: micro-optics design and process, WLO or DOE researches, optics devices packaging process. Applicants with less related experiences would be considered for junior position.
lKnowledge on wafer level optics and DOE design and process and hands-on experiences in E-beam lithography, DRIE, PECVD, evaporating etch.
lHands-on experiences in any of skills: Optics element performance testing, reliability testing etc.
lCandidates with less experience will be considered as Optics Engineer.
lSix-sigma knowledge and certification are preferred.
lAbility to work independently and strong problem-solving skills.
lGood command of both spoken and written English and Chinese.
Brightlaser Limited was founded in 2006 with the mission of “Innovations For More Freedoms”.
Brightlaser’s Core Competences
Brightlaser is a global leading supplier in VCSELs from components to total solutions for AI applications including Optical Communication, Consumer Electronics, ADAS, Machine Vision, Telecom, Robotics, Smart House, Surveillance System, etc.
Brightlaser has its own VCSEL technologies in wafer design, and self-developed advanced chip process. Brightlaser established branch offices in Shen Zhen and Zhong Shan of China. The factory located in Zhong Shan covers an area of 15,000㎡, equipped with globally mainstream GaAs techniques, and the first 6-inch VCSEL chip fab line in mainland China.
Address: Units 7-10, 12/F, North Wing Delta House, No. 3 On Yiu Street, Shatin NT, Hong Kong