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Process Engineer for IC Package and Module Device Assembly ManufacturingUBoT Incorporated Limited
  • Not Specified
  • Salary negotiable
  • Posted on 22 Mar 2019
Process Engineer for IC Package and Module Device Assembly ManufacturingUBoT Incorporated Limited
Job Highlights
  • Develop new process with innovation
  • Reinforce health and safety practices for workers
  • Should demonstrate strong technical acumen.
Job Description

Roles and Responsibilities:

  1. Develop new process with innovation and support new technology exploration and evaluation.
  2. Support new product development in manufacturing process design and evaluation.
  3. Review process for quality and cost optimization to increase manufacturing and quality reliability.
  4. Establish and support scale up practice/guidelines and evaluation process.
  5. Perform preventive maintenance and troubleshooting and repairs of production equipment.
  6. Enhance team technical capability through training and knowledge sharing.
  7. Study and initiate implementation of Best in Industry practices and provide creative Engineering solutions to enhance Quality and Productivity.
  8. Conduct process risks evaluations to mitigate chances of shipping nonconforming materials to the Customers.
  9. Utilize skills in employing use of various statistical methods in conducting evaluations, data interpretations and process improvements .
  10. Reinforce health and safety practices for workers , and adherence to health and safety regulations specifically for process equipment.
  11. Employ preventive methods in addressing process issues with the use of various preventive engineering tools.
  12. Presides over the production of new equipment from initial to production mode capability.
  13. Support Production Planning and Sustaining Engineering in managing workloads to consistently meet productivity targets .
  14. Works with Project Managers on assigned and ad-hoc tasks throughout the project lifecycle.


Job Qualification Requirements:

  1. Must possess evidence of good Process Engineering work knowledge in IC manufacturing.
  2. Full hands on operation of die attach and wire bond equipment.
  3. Should demonstrate strong technical acumen.
  4. Good understanding of DoE, FMEA, statistics and instrumentation; strong in analytical methods.
  5. Responsible for developing machine automation, optimization and packaging process, study and refinement.
  6. Monitors and supervises assigned project from inception to handover including overall project planning, progress monitoring.
  7. Ensures project deliverables are in compliance with design specifications, safety, environmental & quality objectives and statutory regulations; accomplishes the project within prescribed program, resources and project budget.
  8. Must have strong problem solving skills and should have good knowledge of various statistical techniques and preventive methodologies.
  9. Must have the ability to work under stress conditions and intense pressure.
  10. Must have good experience in value stream mapping and benchmarking.
  11. Must have solid knowledge of process specifications and Best in Industry practices in IC manufacturing.
  12. Should possess good familiarities with the IC industry standards and test methodologies.
  13. Must have good understanding of universal health and safety practices.
  14. Must demonstrate evidence of familiarity with the automotive industry requirements.
  15. Must be team and people oriented.

Interested candidate please submit your detailed resume, telephone number and expected salary by "Clicking Apply Now" and we are looking forward to meeting with you for interview.

All Personal data collected will be used for recruitment purpose only.

Additional Information
Career Level
Entry Level
Qualification
Not Specified
Years of Experience
Not Specified
Employment Type
Full Time, Permanent
Company details
EXPATRIATE POSITION, OPENING FOR MOLDING ENGINEERING MANAGER / MOLDING ENGINEER An established electronic components/semiconductor engineering solution provider is expanding into the area of advanced component packaging. We are looking for a high-caliber Senior Engineer/ Engineering Manager in Molding Engineering and/or Material Science and with solid experience in Liquid-Crystal-Polymer(LCP) and similar advanced engineering plastics using insert molding. The candidate will best fit to the position if possessing extensive knowledge and exposure in mold-tool design, mold-tool fabrication and maintenance, injection molding process using different variety of LCP and similar polymer material. Veterans from the automotive component industry with shop-floor knowledge and expertise in insert molding, reel-to-reel base insert mold injection molding, vertical insert mold injection molding, will also be welcomed.
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