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Listed three days ago

This is a Full time job

subClassification: Process Engineering
classification: Engineering
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
3d ago
Listed twenty nine days ago

This is a Full time job

subClassification: Process Engineering
classification: Engineering
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
29d ago
Listed one day ago

This is a Full time job

subClassification: Purchasing, Procurement & Inventory
classification: Manufacturing, Transport & Logistics
  • Monitor and follow up with suppliers to ensure timely delivery
  • Responsible for P/O release, price negotiation and supplier quality follow up
  • Attractive package
1d ago
Listed four days ago

This is a Full time job

subClassification: Purchasing, Procurement & Inventory
classification: Manufacturing, Transport & Logistics
  • Procurement, Purchasing & Inventory, Policies Review
  • Solid experience in parts and machinery purchasing functions
  • Stable working environment/ Immeditely available is highly preferred
4d ago
Listed twenty three days ago

This is a Full time job

subClassification: Process Engineering
classification: Engineering
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
23d ago
Listed three days ago

This is a Full time job

subClassification: Technical Writing
classification: Information & Communication Technology
  • Degree or higher in Mechanical Engineering / Physics or relevant disciplines
  • Design cooling and heating systems and follow through the deployment
  • Drive thermal designs with numerical approaches, model based analysis
3d ago
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