Senior Packaging Engineer
Nexperia Hong Kong Limited- Global Semiconductor Equipment Company
- Knowledge in packing/footprint design
- Experience with AutoCAD/Solidworks is a plus
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Nexperia Hong Kong Limited
System & Process Integration Expert
Nexperia Hong Kong Limited- Global Semiconductor Equipment Company
- At least 3 years in Semiconductor Device Packaging
- Architectural thinking and technical leadership
Senior Administration Officer
Nexperia Hong Kong Limited- Global Semiconductor Equipment Company
- At least 4 years experience in office admin
- Reliable and detailed minded
Principal Engineer (Modelling)
Nexperia Hong Kong Limited- Global Semiconductor Equipment Company
- Knowledge in thermal & mechanical multi-physic
- Knowledge in characterization methods
Principal Package R&D Material Engineer
Nexperia Hong Kong Limited- Global Semiconductor Equipment Company
- At least 5 years experience in the Material field
- Solid knowledge in Material selection
Principal Engineer Semiconductor Package Research
ITEC Technologies Hong Kong Limited- Global Semiconductor Equipment Manufacturer
- Experience in Semiconductor Device Packaging
- Architectural thinking and technical leadership
Sr. Principal Engineer (Based in Guangdong)
Nexperia Hong Kong Limited- Machine and Tooling Design experiences
- Strong Knowledge on Mechanical, Tooling
- Experience in Metrology/Fabrication/Machining
Principal Process Integration Engineer (Based in Guangdong)
Nexperia Hong Kong Limited- At least 10 years semiconductor field experience
- Experienced semiconductor new technology
- Experienced semiconductor new package introduction
Senior Wire Bonding Engineer (Based in Guangdong)
Nexperia Hong Kong Limited- Hands-on wire bonding machine
- Solid knowledge in process characterization and cu
- Wire material properties characterization
Principal TrimForm Process Development Engineer (Based in Guangdong)
Nexperia Hong Kong Limited- Solid knowledge in Mechanical, Trim & Form process
- Hands-on experience in process singulation
- Solid leadership of cross-functional projects
Technical expert Power Modules Packaging Equipment (Based in Wuxi)
Nexperia Hong Kong Limited- Strong Knowledge on power module packaging
- Work experience in Semiconductor environment
- Experience in various DB machines
Principal Engineer - Pre Assembly Engineering (Based in Wuxi/Guangdong)
Nexperia Hong Kong Limited- Pre assembly in Semiconductor manufacturing
- Strong Knowledge on dicing, grinding, wafer taping
- Experience in dicing technologies
Project Manager (Based in Guangdong)
Nexperia Hong Kong Limited- Experience in Project Management
- Solid project management knowledge
- Good interpersonal skills and leadership ability
Principal Clip/Die Attach Engineer (Based in Guangdong)
Nexperia Hong Kong Limited- Strong Knowledge on Mechanical, Tooling
- Strong Knowledge on Electrical, Electronics
- Strong Knowledge on AOI and Mechatronics systems
Trim and Form Technical Expert (Based in Guangdong)
Nexperia Hong Kong Limited- Machine and Tooling Design experiences
- Strong Knowledge on Mechanical, Tooling
- Experience in Metrology/Fabrication/Machining
Business Process Expert (m/f/d) – Plant Maintenance
Nexperia Hong Kong LimitedDirector Product Management ITEC
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