• Shenzhen Based
  • Engineering Consultancy
  • Clear Career Advancement Pathways

18-Jul-18

 

Applied
  • 13 month bonus
  • bachelor
  • product design

12-Jul-18

 

Applied
  • Design & optimize the low power generating device
  • Design and optimize packaging material
  • Degree in Electronic / Mechatronics Engineering

12-Jul-18

 

Applied
  • New technologies in IC design
  • Micro-architecture design, HDL coding
  • Exp in FPGA prototyping and IC tapeout

12-Jul-18

 

Applied
  • Develop simulation code in C/C++ /MATLAB
  • Digital communication or digital signal processing
  • Communication system LTE-Advanced/LTE

11-Jul-18

 

Applied
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  • Carry out design & RTL implementation of circuits
  • Execute module level & system level verification
  • Perform logic synthesis and timing analysis

10-Jul-18

 

Applied
  • Bachelor degree in Mechanical/Mechatronic
  • Mechanical design of automatic equipment
  • Automation project management

10-Jul-18

 

Applied
  • SDA, kitchen appliances
  • Mechanical, Manufacturing
  • OEM and ODM products

09-Jul-18

 

Applied
  • tender submission
  • Degree in Civil/ Structural/ Geotechnical Engineer
  • Minimum 8 years relevant experience

06-Jul-18

 

Applied
  • Hands-on & experienced Industrial Design Engineer
  • Industry Leading Innovative products with patents
  • Safety driven brand with global pressence

05-Jul-18

 

Applied
  • Master each individual product design
  • Drive continuous improvement program
  • 5 years of proven experience in kitchen appliance

04-Jul-18

Salary negotiable

Applied
  • Lead the computer vision
  • Optimizing, modelling and simulating algorithms
  • pattern recognition algorithm research

28-Jun-18

 

Applied
  • Design system - fronted and backed
  • Web and Mobile Application Design
  • Passionate in software technology

28-Jun-18

 

Applied
  • Degree in Civil Engineering or equivalent
  • 8 years or more civil design experience
  • membership of ICE or HKIE is preferred

26-Jun-18

 

Applied
  • Electrical/electronic engineering, Master or above
  • Interconnect and/or substrate technologies
  • Materials science & engineering

20-Jun-18

 

Applied
  • Perform the digital firmware design
  • control loop of power system
  • using the firmware design methodology

20-Jun-18

 

Applied