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Listed two days ago

(Senior) Application Process Engineer in Advanced Packaging Technology Group

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Process Engineering
Process Engineering
classification: Engineering
(Engineering)
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
2d ago
Be an early applicant
Listed twenty nine days ago

(Senior) Application Process Engineer in Advanced Packaging Technology Group

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Process Engineering
Process Engineering
classification: Engineering
(Engineering)
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
29d ago
Be an early applicant
Listed six days ago

Post-doctoral Fellow in the Department of Mechanical Engineering (526037)

at The University of Hong Kong

This is a Full time job

Pok Fu Lam, Southern District
subClassification: Mechanical Engineering
Mechanical Engineering
classification: Engineering
(Engineering)
  • A PhD degree in Mechanical Engineering, Biomedical Engineering
  • Drafting proposals, reports and presentations relevant to the projects
  • Driving research activities towards defined goals in specified timeline
6d ago
Be an early applicant
Listed nineteen days ago

5G/6G Embedded System Design - Principal Engineer / Lead Engineer / Senior...

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
subClassification: Electrical/Electronic Engineering
Electrical/Electronic Engineering
classification: Engineering
(Engineering)
  • Develop DSP solutions for 5G/6G L1 layer (PHY)
  • Exp in DSP/embedded system programming in ARM/X86
  • Knowledge of wireless communications systems
19d ago
Be an early applicant
Listed nineteen days ago

(Senior) Application Process Engineer in Advanced Packaging Technology Group

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Process Engineering
Process Engineering
classification: Engineering
(Engineering)
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
19d ago
Listed twenty three days ago

Post-doctoral Fellow in the Department of Mechanical Engineering (526037)

at The University of Hong Kong

This is a Full time job

Pok Fu Lam, Southern District
subClassification: Mechanical Engineering
Mechanical Engineering
classification: Engineering
(Engineering)
  • A PhD degree in Mechanical Engineering, Biomedical Engineering
  • Drafting proposals, reports and presentations relevant to the projects
  • Driving research activities towards defined goals in specified timeline
23d ago
Be an early applicant
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