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Listed one day ago

Japanese Speaking Sales Executive (Semiconductor trading)

at Aline Company Limited

This is a Full time job

Kwun Tong, Kwun Tong District
$20,000 – $25,000 per month
subClassification: Account & Relationship Management
Account & Relationship Management
classification: Sales
(Sales)
  • 3+ yrs sales exp. in semiconductor trading, mainly handle Japanese clients
  • Familiar w/semiconductor industry w/good Japanese, Cantonese, English & Mandarin
  • 5-day work, Double Pay, Discretionary Bonus, Medical Insurance
1d ago
Listed seven days ago

(Senior) Application Process Engineer in Advanced Packaging Technology Group

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Process Engineering
Process Engineering
classification: Engineering
(Engineering)
  • MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
  • Hand-on experience in various semiconductor assembly equipment is preferred
  • Familiar with the analytical equipment for failure mode analysis
7d ago
Listed one day ago

(Senior) Quality Engineer in Advanced Packaging Group

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Quality Assurance & Control
Quality Assurance & Control
classification: Manufacturing, Transport & Logistics
(Manufacturing, Transport & Logistics)
  • Minimum 3 – 5 years’ solid working experience
  • Strong knowledge of DFMEA, PFMEA, Quality Control Plans, end-to-end yield etc.
  • Willing to travel to China and Singapore factories
1d ago
Listed seven days ago

Thermal Engineer (IANG Holder Is Welcome)

at ASMPT Technology Hong Kong Limited

This is a Full time job

Tsing Yi, Kwai Tsing District
subClassification: Technical Writing
Technical Writing
classification: Information & Communication Technology
(Information & Communication Technology)
  • Degree or higher in Mechanical Engineering / Physics or relevant disciplines
  • Design cooling and heating systems and follow through the deployment
  • Drive thermal designs with numerical approaches, model based analysis
7d ago
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