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Listed six hours ago

VCSEL Device Engineer

at 新亮激光有限公司
Be an early applicant

This is a Full time job

Sha Tin District
  • Build global AI photonics across the full lifecycle at Hong Kong Science Park.
Drive the design, fabrication, and testing of advanced global VCSEL devices.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
6h ago
Listed seven hours ago

(Senior) Digital Design Engineer

at ASMPT Technology Hong Kong Limited
Be an early applicant

This is a Full time job

Tsing Yi, Kwai Tsing District
  • Double pay & Discretionary bonus
  • Clear career growth opportunities with comprehensive trainings
  • Gain exposure in cutting-edge technology in a sizable, reputable company
Join us as a Digital Design Engineer to design and support digital hardware platforms for semiconductor packaging machines
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
7h ago
Listed seventeen days ago

Senior Lead Engineer/Lead Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
17d ago
Listed seventeen days ago

Principal Engineer/Associate Principal Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 10+ years' experience in advanced packaging and process development
  • Expertise in panel level and wafer level process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
17d ago
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