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Listed seventeen days ago

Chief Engineer, Advanced Packaging

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
  • 10+ years’ working experience in Semiconductor Industry
  • Expertise in advanced package and wide network & collaboration
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
17d ago
Listed nineteen days ago

Senior Technician - Carpenter (高級技工 - 木工)

at Kerry Hotel, Hong Kong
Be an early applicant

This is a Full time job

Hung Hom, Kowloon City District
You will be maintaining and repairing all hotel facilities, equipment, and systems to ensure smooth daily operations.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
19d ago
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