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Listed eleven days ago

Technical Support Service Engineer

at Cardlinks Technologies (HK) Company Limited

This is a Full time job

Ngau Tau Kok, Kwun Tong District
Attractive post to show your technical experience to assist customer to complete the Access Control System operations.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
11d ago
Listed seventeen days ago

Principal Engineer/Associate Principal Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 10+ years' experience in advanced packaging and process development
  • Expertise in panel level and wafer level process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
17d ago
Listed seventeen days ago

Chief Engineer, Advanced Packaging

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
  • 10+ years’ working experience in Semiconductor Industry
  • Expertise in advanced package and wide network & collaboration
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
17d ago
Listed seventeen days ago

Senior Lead Engineer/Lead Engineer, Digital IC Design

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant

This is a Full time job

Sha Tin District
  • Master degree in Electrical Engineering or relevant disciplines with 5 years exp
  • Hands-on experience in Verilog coding, IC design and verification is a must
  • Candidates with less experience will be considered as Senior Engineer/Engineer
Digital IC design (front-end and back-end); FPGA prototyping; full-flow tape-out from architecture/specification to chip bring-up
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
17d ago
Listed seventeen days ago

Senior Engineer/Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 2+ years' experience in advanced packaging and process development
  • Work with product design and material development teams
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
17d ago
Listed seventeen days ago

Senior Lead Engineer/Lead Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
17d ago
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