Related searches

Modify my search
Listed sixteen days ago

Principal Engineer/Associate Principal Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 10+ years' experience in advanced packaging and process development
  • Expertise in panel level and wafer level process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
16d ago
Listed four days ago

Senior Manager, Accounting, Reporting and Budgeting

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Qualified Accountant w/ 10+ years of experience in Financial Accounting
  • A self-motivator with strong sense of ownership
  • Supervise, monitor, and review all day-to-day accounting activities
Senior manager grade finance professional with strong financial accounting fundamentals to lead the Accounting, Reporting and Budgeting function
subClassification: Financial Accounting & ReportingFinancial Accounting & Reporting classification: Accounting(Accounting)
4d ago
Listed three days ago

Chief Director, AI Platform & Solutions

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Technical Department Leader at a HK Government-Funded Institute
  • Excellent promotion opportunities and benefit.
  • An excellent working environment at the Hong Kong Science Park.
The incumbent will lead our professional technical department, applying their expertise in the field of AI Platform & Solutions.
subClassification: ManagementManagement classification: Information & Communication Technology(Information & Communication Technology)
3d ago
Listed sixteen days ago

Chief Engineer, Advanced Packaging

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
  • 10+ years’ working experience in Semiconductor Industry
  • Expertise in advanced package and wide network & collaboration
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
16d ago
Listed sixteen days ago

Officer, Accounting, Reporting and Budgeting

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Join a leading innovation organization
  • Strong work-life balance
  • Great career foundation in finance
This role handle payments, budgeting, reporting and financial controls at ASTRI, offering broad finance exposure and strong benefits.
subClassification: Financial Accounting & ReportingFinancial Accounting & Reporting classification: Accounting(Accounting)
16d ago
Listed twenty days ago

Officer, Accounting, Reporting and Budgeting

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Join a leading innovation organization
  • Strong work-life balance
  • Great career foundation in finance
This role handle payments, budgeting, reporting and financial controls at ASTRI, offering broad finance exposure and strong benefits.
subClassification: Financial Accounting & ReportingFinancial Accounting & Reporting classification: Accounting(Accounting)
20d ago
Listed sixteen days ago

Senior Engineer/Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 2+ years' experience in advanced packaging and process development
  • Work with product design and material development teams
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
16d ago
Listed sixteen days ago

Senior Lead Engineer/Lead Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
16d ago
Listed eighteen days ago

Director, RFS

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant

This is a Full time job

Sha Tin District
  • R&D within the I&T sector for government-funded institute.
  • Excellent promotion opportunities and benefits.
  • Stable working environment in HK Science and Technology Parks.
The incumbent will join our R&D team as a leader to utilize their professionalism in the field of RFS.
subClassification: OtherOther classification: Information & Communication Technology(Information & Communication Technology)
18d ago
Listed sixteen days ago

Senior Lead Engineer/Lead Engineer, Digital IC Design

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant

This is a Full time job

Sha Tin District
  • Master degree in Electrical Engineering or relevant disciplines with 5 years exp
  • Hands-on experience in Verilog coding, IC design and verification is a must
  • Candidates with less experience will be considered as Senior Engineer/Engineer
Digital IC design (front-end and back-end); FPGA prototyping; full-flow tape-out from architecture/specification to chip bring-up
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
16d ago
Modify my search
How relevant are your results?

Receive new jobs for this search by email

Return to search results
Modify my search

Select a job

Display details here