Listed fourteen days ago
This is a Full time job
Sha Tin District
- Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
- 10+ years’ working experience in Semiconductor Industry
- Expertise in advanced package and wide network & collaboration
- Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
- 10+ years’ working experience in Semiconductor Industry
- Expertise in advanced package and wide network & collaboration
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
14d ago
14d ago