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Listed one hour ago
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
1h ago
Listed two days ago

This is a Full time job

Tsing Yi, Kwai Tsing District
  • Double pay & Discretionary bonus
  • Clear career growth opportunities with comprehensive trainings
  • Gain exposure in cutting-edge technology in a sizable, reputable company
Join us as a Digital Design Engineer to design and support digital hardware platforms for semiconductor packaging machines
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
2d ago
Listed eighteen days ago
  • hands-on experience in operating power semicon packaging and assembly equipment
  • Hong Kong first Microelectronics R&D Centre
  • Under the Research Talent Hub (RTH) scheme
The MRDI is looking for a dynamic and high-calibre professional to fill the position of Senior Engineer (RTH), Packaging Process
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
18d ago
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