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Listed seven hours ago

Senior Engineer/Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant
Urgently hiring

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 2+ years' experience in advanced packaging and process development
  • Work with product design and material development teams
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
7h ago
Listed seven hours ago

Senior Lead Engineer/Lead Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant
Urgently hiring

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
7h ago
Listed nine days ago

Manager/Senior Electronic Engineer (Robotics)

at Primech Hong Kong Limited

This is a Full time job

Science Park, Tai Po District
$35,000 – $50,000 per month
Bachelor’s or Master’s Degree in Electronic Engineering, Electrical Engineering, Mechatronics, or a related discipline.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
9d ago
Listed more than thirty days ago

Hardware Structural Design Engineer

at PanoSense Tech Limited
Be an early applicant

This is a Full time job

Hong Kong SAR
Lead structural design and optimization for smart hardware products Design product enclosure, internal stacking, and thermal management Drive...
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
30d+ ago
Listed more than thirty days ago

RFID Hardware Product Engineer

at CHINAWIN MICROELECTRONICS LIMITED
Be an early applicant

This is a Full time job

Hong Kong SAR
Experience: 3-5+ years of experience in hardware R&D or as a Hardware Product Engineer. Prior experience in successfully taking complete RFID IoT...
subClassification: Project ManagementProject Management classification: Engineering(Engineering)
30d+ ago
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