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Show 1 job at Stack Electronics Limited
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Listed twelve hours ago

Shipping Officer

at Stack Electronics Limited

This is a Full time job

Kwun Tong, Kwun Tong District
$20,000 – $22,000 per month
Shipping manager role in manufacturing firm. Oversee efficient logistics, customs compliance. Competitive salary, excellent benefits.
subClassification: Warehousing, Storage & DistributionWarehousing, Storage & Distribution classification: Manufacturing, Transport & Logistics(Manufacturing, Transport & Logistics)
12h ago
Listed twelve hours ago

Senior Engineer/Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited
Urgently hiring

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 2+ years' experience in advanced packaging and process development
  • Work with product design and material development teams
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
12h ago
Listed twelve days ago

IT Developer II

at Fastprint HK Co. Ltd.
Urgently hiring

This is a Full time job

Tsim Sha Tsui, Yau Tsim Mong District
$33,333 – $50,000 per month
Full Stack Developer building internal software systems and digital solutions for a global electronics company.
subClassification: Developers/ProgrammersDevelopers/Programmers classification: Information & Communication Technology(Information & Communication Technology)
12d ago
Listed twelve hours ago

Senior Lead Engineer/Lead Engineer, 3D Package

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant
Urgently hiring

This is a Full time job

Sha Tin District
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
12h ago
Listed more than thirty days ago

Hardware Structural Design Engineer

at PanoSense Tech Limited
Be an early applicant

This is a Full time job

Hong Kong SAR
Lead structural design and optimization for smart hardware products Design product enclosure, internal stacking, and thermal management Drive...
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
30d+ ago
Listed more than thirty days ago

RFID Hardware Product Engineer

at CHINAWIN MICROELECTRONICS LIMITED
Be an early applicant

This is a Full time job

Hong Kong SAR
Experience: 3-5+ years of experience in hardware R&D or as a Hardware Product Engineer. Prior experience in successfully taking complete RFID IoT...
subClassification: Project ManagementProject Management classification: Engineering(Engineering)
30d+ ago
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