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Listed thirteen days ago

Chief Engineer, Advanced Packaging

at Hong Kong Applied Science and Technology Research Institute Company Limited
Be an early applicant

This is a Full time job

Sha Tin District
  • Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
  • 15+ years’ working experience in Semiconductor and/or New Energy Industries
  • Expertise in electronics materials, power electronics, photovoltaic, etc.
  • Master's degree or above in Electronics Packaging, Mechanical Engineering, etc.
  • 15+ years’ working experience in Semiconductor and/or New Energy Industries
  • Expertise in electronics materials, power electronics, photovoltaic, etc.
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
Responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
13d ago
13d ago
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