Listed more than fourteen days ago
We are developing wheeled and humanoid robots for multiple applications
14 日前
8 個職位
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Listed more than twenty four days ago
Application Engineer supporting semiconductor bonding technology across Asia.
24 日前•即將截止
Listed more than twenty days ago
此為Full time職位
香港島
$95,000 – $120,000 per year（AUD）
Lead cutting-edge BIPV innovation. Competitive salary, professional development, exposure to high growth industry and expertise.
20 日前
Listed more than thirty days ago
Job Title: 研究助理（嵌入式开发工程师） Department: 智能泛在物联网理论与应用学科创新引智基地 111 Center for Theory and Application of Intelligent Ubiquitous Internet of...
超過 30 日
Listed more than thirty days ago
Conduct preliminary research, forecasting, and medium- to long-term planning for the company's AI strategy. Stay informed of AI advancements and...
超過 30 日
Listed more than sixteen days ago
此為Full time職位
科學園, 大埔區
$25,000 – $37,500 per month
cooling system design and testing, or thermal simulation, heat dissipation structure design, and thermal testing and optimization.
16 日前
Listed more than thirty days ago
Participate in mechanical structure and hardware development.
Support prototype design, testing and product optimization.
Coordinate system...
超過 30 日
Listed more than thirty days ago
此為Full time職位
香港
Job Title: 研究助理（机器人运动控制算法工程师） Department: 智能泛在物联网理论与应用学科创新引智基地 111 Center for Theory and Application of Intelligent Ubiquitous Internet of...
超過 30 日
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