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Listed more than one day ago
Advancing PCB & Chip Integration for AI/High-Speed Computing "From material innovation to system reliability—own the roadmap that connects silicon"
subClassification: Chemistry & PhysicsChemistry & Physics classification: Science & Technology(Science & Technology)
1 小時前
Listed more than eighteen days ago
  • 5 day work, friendly working environment & comprehensive medical coverage
  • Global exposure with excellent career development opportunities
  • Drive the development of new material technologies
Research and development initiatives leveraging Artificial Intelligence in the field of materials science, with a focus on chemical engineering.
subClassification: Materials Handling EngineeringMaterials Handling Engineering classification: Engineering(Engineering)
18 小時前
Listed more than five days ago
  • Ph.D. degree engineering related (preferably CSE, ECE, MAE, or Robotics)
  • Investigate and develop innovative solutions in construction robotics
  • Fringe benefits including annual leave, medical and dental benefits etc
Investigate and develop innovative solutions and prototypes in construction robotics.
subClassification: Research & FellowshipsResearch & Fellowships classification: Education & Training(Education & Training)
5 日前
Listed more than thirty eight days ago
  • Honours ’s degree or higher in Electronic Engineering or related disciplines
  • Competence in signal processing and data analysis using Python and/or MATLAB
  • Good command of written and spoken English and Chinese (Cantonese),
N/A
subClassification: Research & FellowshipsResearch & Fellowships classification: Education & Training(Education & Training)
38 分鐘前
Listed more than two days ago
  • Lead R&D projects
  • Develop software/robotics solutions
  • PowerBI, Notion, Asana, Robotic or Drone operation
Responsibilities: Lead R&D projects from start to finish and coordinate with stakeholders
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
2 日前
Listed more than fifty days ago
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 2+ years' experience in advanced packaging and process development
  • Work with product design and material development teams
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
50 分鐘前
Listed more than six days ago
You will conduct research on battery materials, such as electrodes and electrolytes for lithium-ion, sodium-ion and solid-state systems
subClassification: Materials SciencesMaterials Sciences classification: Science & Technology(Science & Technology)
6 日前
Listed more than twenty nine days ago
  • 5-day week, bank holiday, free lunch, Company coach
  • Opportunity to work on PCB/AI chips/semiconductor metallization technologies
  • Fresh graduates or early career candidates are welcome
The engineer will need to manage R&D projects, handle metallization process, exchange ideas with stakeholders and travel overseas occasionally.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
29 日前即將截止
Listed more than thirty days ago
  • Degree in Building / Civil / Mechanical Engineering
  • 5 years' relevant working experience.
  • Chartered membership of professional institution
Responsibilities Support the Innovation and Technology Department on exploring and managing innovative applications and technology......
subClassification: Engineering - SoftwareEngineering - Software classification: Information & Communication Technology(Information & Communication Technology)
超過 30 日
Listed more than seven days ago
We are looking for an AI Application Engineer with strong computer science fundamentals
subClassification: Engineering - SoftwareEngineering - Software classification: Information & Communication Technology(Information & Communication Technology)
7 日前
Listed more than twenty eight days ago
preferably in science, biology, biomedical science or a related discipline with relevant work experience.
subClassification: Biological & Biomedical SciencesBiological & Biomedical Sciences classification: Science & Technology(Science & Technology)
28 日前即將截止
Listed more than fifty one days ago
  • Bachelor's degree or above in Mechanical Engineering, Material Engineering, etc.
  • 5+ years' experience in advanced packaging and process development
  • Expertise in panel level package process development
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
51 分鐘前
Listed more than twenty days ago
  • Work on advanced testing, validation and calibration projects
  • Expand your expertise in an accredited laboratory environment
  • 5-day Work; Double Pay; Performance Bonus; Free Shuttle Bus; Training Subsidies
Advance your technical career by working on complex testing, method development, validation and calibration activities.
subClassification: Laboratory & Technical ServicesLaboratory & Technical Services classification: Science & Technology(Science & Technology)
20 小時前
Listed more than thirteen days ago
  • AI Application, Research and Development
  • IC Design, Design Automation Technologies
  • Electronics, Electrical, Computer Engineering
Research Assistants are expected to be involved in the development of one or multiple research programs and projects in the Center.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
13 日前
Listed more than thirteen days ago

此為Full time職位

科學園, 大埔區
$20,000 – $30,000 per month
  • Ship algorithms/systems to real production lines
  • Guaranteed patent submissions + conference publications with academic mentors
Define how robots see, decide, and act in the real world. you'll either Build 3D perception brains and engineer robot nervous systems.
subClassification: Research & FellowshipsResearch & Fellowships classification: Education & Training(Education & Training)
13 日前
Listed more than thirteen days ago
  • AI Application, Research and Development
  • IC Design, Design Automation Technologies
  • Electronics, Electrical, Computer Engineering
Involved in one of the research programs and will conduct collaborative research in one or multiple research projects in the Center
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
13 日前
Listed more than twenty five days ago

此為Full time職位

荃灣, 荃灣區
$17,000 – $24,000 per month
R&D Assistant
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
25 日前即將截止
Listed more than fifteen days ago
  • Lead high-impact surgical robotics R&D and bridge prototypes to production
  • Drive critical supplier DFM negotiations and overall verification planning
  • Enjoy an innovative culture, competitive salary, and a 5-day work week
Lead surgical robotics R&D through supplier DFM negotiation, verification planning, and cutting-edge device development.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
15 日前
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