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Listed more than twenty five days ago

R&D Engineer (software)

於 Winley Technology Limited

此為Full time職位

天后, 東區
  • R&D, Electronics, Robotics, IoT, Automation, 3D Scanning, LiDar, computer vision
  • Hardware, control programming, algorithm, SLAM, Image processing
  • HK based, 5-days work, medical insurance, MPF
We are a fast-growing company specialized in intelligent infrastructure assessment system. We are looking for high-caliber talent to join us.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
25 日前•即將截止
Listed more than sixteen days ago

Engineer (C++ & Python)

於 SAE Magnetics (Hong Kong) Ltd

此為Full time職位

科學園, 大埔區
  • Double pay + Discretionary Bonus
  • 12-19 Days Annual Leave
  • Group Medical & Dental Benefit
Support the design of next-generation magnetic recording heads through data analysis, product testing, and failure troubleshooting.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
16 日前
Listed more than five days ago

Senior FPGA Engineer / FPGA Engineer

於 Hong Kong Gowin Semiconductor Co., Limited

此為Full time職位

沙田, 沙田區
Build a next-gen AI agent platform to automate FPGA design at Gowin. Bridge the gap between hardware engineering and generative AI.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
5 日前
Listed more than sixteen days ago

Senior Software Engineer

於 CoolStar Innovation Technology Limited

此為Full time職位

科學園, 大埔區
$30,000 – $35,000 per month
material process design, process parameter adjustment, production process supervision, process optimization and material performance control.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
16 日前
Listed more than twenty four days ago

Senior FPGA Engineer

於 Hong Kong Gowin Semiconductor Co., Limited

此為Full time職位

沙田, 沙田區
  • Build Generative AI & Agentic Workflows for Hardware
  • End-to-End RTL Automation
  • Local LLM Deployment & FPGA Acceleration
Build a next-gen AI agent platform to automate FPGA design at Gowin. Bridge the gap between hardware engineering and generative AI.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
24 日前•即將截止
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